What are the main production processes for SMT surface mount PCBA

The main process of standard SMT surface mount PCBA usually includes the following key steps:

Incoming inspection: Conduct strict checks on materials such as PCBs, components, solder paste, etc.

Solder Paste Printing: Use a steel mesh and printing machine to accurately print solder paste onto the solder pads of the PCB.

SPI testing: After solder paste printing, the thickness, area, volume, and position of the solder paste are checked using a 3D solder paste tester to 

ensure printing quality.

SMT: SMT machines use high-precision suction nozzles to pick up components and accurately place them on the solder paste of the PCB according to the 

programmed position.

AOI inspection: After surface installation, automatic optical inspection equipment checks the placement position, polarity, and whether there are any 

omissions or incorrect placement of components.

Reflow soldering: The assembled PCB is passed through a reflow soldering furnace, where the solder paste melts to form reliable solder joints, firmly 

soldering the components onto the PCB.

Cleaning: Remove welding residues (according to process requirements).

PCBA testing: Conduct online testing, functional testing, aging testing, etc. to ensure that PCBA functional performance meets standards.

Final appearance inspection and packaging: visual inspection or AOI final inspection, qualified products undergo anti-static packaging.