Detailed explanation of SMT surface mount technology: core advantages and process flow
Time:2025-09-03
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1. SMT technology definition
SMT (Surface Mount Technology) is an advanced process for mounting micro electronic components (SMDs) directly onto PCB boards. Its core benefits include:
High-density integration: Supports 01005 ultra-small components (0.4mm×0.2mm) and 0.25mm pitch BGA, suitable for micro devices such as smartphones.
Performance Enhancement: The leadless design reduces parasitic inductance and optimizes high-frequency circuit performance.
Cost-effectiveness: Fully automated production reduces labor costs and increases efficiency by more than 80% compared to traditional plug-in technology (THT).
2. SMT key process flow
Solder paste printing: Solder paste is accurately applied through the stencil, and SPI testing ensures that the thickness and position error ≤ 10μm.
Component placement: High-speed placement machine (CPH≥30,000) completes micron-level precision placement.
Reflow soldering: The temperature control curve is divided into three stages: preheating, melting (above 217°C), and cooling to form a reliable solder joint.
AOI inspection: automatic optical inspection to identify defects such as missing parts and offsets, with a through-pass rate > 99.5%.
3. Industry application scenarios
It is suitable for consumer electronics (mobile phones/smart wearables), automotive electronics (ECU modules), medical equipment (micro sensors) and other fields, and meets the IPC-A-610 Class 3 standard.
Chengdu Dali Electronics Co., Ltd. is a national high-tech enterprise that integrates high-end FPGA/MCU solution design and professional PCBA surface mount manufacturing. We specialize in providing full stack solutions for industrial automation, consumer electronics, medical equipment, and other fields, from core hardware design and software development to high-quality manufacturing. We are particularly skilled in innovation and application of industrial grade audio and video processing technology.
SMT (Surface Mount Technology) is an advanced process for mounting micro electronic components (SMDs) directly onto PCB boards. Its core benefits include:
High-density integration: Supports 01005 ultra-small components (0.4mm×0.2mm) and 0.25mm pitch BGA, suitable for micro devices such as smartphones.
Performance Enhancement: The leadless design reduces parasitic inductance and optimizes high-frequency circuit performance.
Cost-effectiveness: Fully automated production reduces labor costs and increases efficiency by more than 80% compared to traditional plug-in technology (THT).
2. SMT key process flow
Solder paste printing: Solder paste is accurately applied through the stencil, and SPI testing ensures that the thickness and position error ≤ 10μm.
Component placement: High-speed placement machine (CPH≥30,000) completes micron-level precision placement.
Reflow soldering: The temperature control curve is divided into three stages: preheating, melting (above 217°C), and cooling to form a reliable solder joint.
AOI inspection: automatic optical inspection to identify defects such as missing parts and offsets, with a through-pass rate > 99.5%.
3. Industry application scenarios
It is suitable for consumer electronics (mobile phones/smart wearables), automotive electronics (ECU modules), medical equipment (micro sensors) and other fields, and meets the IPC-A-610 Class 3 standard.
Chengdu Dali Electronics Co., Ltd. is a national high-tech enterprise that integrates high-end FPGA/MCU solution design and professional PCBA surface mount manufacturing. We specialize in providing full stack solutions for industrial automation, consumer electronics, medical equipment, and other fields, from core hardware design and software development to high-quality manufacturing. We are particularly skilled in innovation and application of industrial grade audio and video processing technology.
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